LionCircuits Turnkey PCB Support
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Do you support BGA component assembly ?

At Lioncircuits we provide BGA assembling capabilities with real-time X-ray inspection. For more support, please feel free to drop a mail at [email protected]

To know more details on our Assembly services and capabilities, please click here

Ball Grid Array – BGA SMT Packages ease the high density connection to integrated circuits. It consists of multiple overlapping layers and is used to mount the devices (such as microprocessors) permanently on the board. BGA utilizes solder balls instead of leads. This provides greater efficiency of the SMT prototype assembly and permits to reach smaller ball pitch which increases the miniaturization density.

BGA Technology can be used to achieve advantages in the following factors,

  • Higher pin density
  • Lower inductance leads
  • Better heat conduction
  • Increased performance
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