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LPC18S30FET100E

Manufacturer

NXP Semiconductors

Description

MCU 32-bit ARM Cortex M3 ROMLess 2.5V/3.3V Automotive 100-Pin TFBGA Tray

Datasheet

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Product Attributes

Type

Case/Package

Core Architecture

Frequency

Interface

Lead Free

Lifecycle Status

Max Operating Temperature

Memory Type

Min Operating Temperature

Number of I/Os

Number of Pins

Oscillator Type

Peripherals

RAM Size

REACH SVHC

RoHS

Schedule B

Description

TFBGA

ARM

180 MHz

CAN, EBI/EMI, Ethernet, I2C, IrDA, MMC, SD, SPI, SSP, UART, USART, USB

Lead Free

Production (Last Updated: 8 months ago)

85 °C

ROMless

-40 °C

49

100

Internal

Brown-out Detect/Reset, DMA, POR, WDT

200 kB

Yes

Compliant

8542310000

1389.88

Out of Stock


Quantity
Shipment
delivery

Ships in 7-10 days

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Quantity

Unit Price

Ext. Price

1

1389.88

1389.88

10

1130.39

11303.91

25

1130.46

28261.60

50

1077.76

53888.01

100

936.17

93617.31

500

936.18

468090.21

1000

747.41

747407.69

Product Attributes

Type

Case/Package

Core Architecture

Frequency

Interface

Lead Free

Lifecycle Status

Max Operating Temperature

Memory Type

Min Operating Temperature

Number of I/Os

Number of Pins

Oscillator Type

Peripherals

RAM Size

REACH SVHC

RoHS

Schedule B

Description

TFBGA

ARM

180 MHz

CAN, EBI/EMI, Ethernet, I2C, IrDA, MMC, SD, SPI, SSP, UART, USART, USB

Lead Free

Production (Last Updated: 8 months ago)

85 °C

ROMless

-40 °C

49

100

Internal

Brown-out Detect/Reset, DMA, POR, WDT

200 kB

Yes

Compliant

8542310000

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