Manufacturer
NXP Semiconductors
Description
MCU 32-Bit LPC1800 ARM Cortex M3 RISC ROMLess 3.3V 180-Pin TFBGA Tray
Datasheet
Type
Case/Package
Core Architecture
Frequency
Interface
Lead Free
Lifecycle Status
Max Operating Temperature
Memory Type
Min Operating Temperature
Number of I/Os
Number of Pins
Oscillator Type
Peripherals
RAM Size
REACH SVHC
RoHS
Description
TFBGA
ARM
180 MHz
CAN, EBI/EMI, Ethernet, I2C, IrDA, MMC, SD, SPI, SSP, UART, USART, USB
Lead Free
Production (Last Updated: 8 months ago)
85 °C
ROMless
-40 °C
118
180
Internal
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
200 kB
Yes
Compliant
Ships in 7-10 days
Quantity
Unit Price
Ext. Price
Type
Case/Package
Core Architecture
Frequency
Interface
Lead Free
Lifecycle Status
Max Operating Temperature
Memory Type
Min Operating Temperature
Number of I/Os
Number of Pins
Oscillator Type
Peripherals
RAM Size
REACH SVHC
RoHS
Description
TFBGA
ARM
180 MHz
CAN, EBI/EMI, Ethernet, I2C, IrDA, MMC, SD, SPI, SSP, UART, USART, USB
Lead Free
Production (Last Updated: 8 months ago)
85 °C
ROMless
-40 °C
118
180
Internal
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
200 kB
Yes
Compliant
From initial concept to final product, we ensure seamless support at every stage of your manufacturing journey.