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Manufacturer
Microchip
Description
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
Datasheet
Type
Projected EOL Date
Case/Package
Core Architecture
Country of Origin
Frequency
Interface
Lifecycle Status
Max Operating Temperature
Min Operating Temperature
Number of I/Os
Number of Pins
Operating Supply Voltage
Peripherals
RAM Size
RoHS
Schedule B
Speed Grade
Description
2049-02-04
BGA
ARM
South Korea
166 MHz
CAN, Ethernet, I2C, SPI, UART, USART, USB
Production (Last Updated: 5 months ago)
100 °C
-40 °C
267
484
1.2 V
DDR, PCIe, SERDES
259.3 kB
Compliant
8542390000, 8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|85
1
MOQ : Unavailable
Minimum Qty : Unavailable
Per Unit Price
Unavailable
Total Price
Unavailable
Ships in 7-10 days from Bengaluru
Type
Projected EOL Date
Case/Package
Core Architecture
Country of Origin
Frequency
Interface
Lifecycle Status
Max Operating Temperature
Min Operating Temperature
Number of I/Os
Number of Pins
Operating Supply Voltage
Peripherals
RAM Size
RoHS
Schedule B
Speed Grade
Description
2049-02-04
BGA
ARM
South Korea
166 MHz
CAN, Ethernet, I2C, SPI, UART, USART, USB
Production (Last Updated: 5 months ago)
100 °C
-40 °C
267
484
1.2 V
DDR, PCIe, SERDES
259.3 kB
Compliant
8542390000, 8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|8542390000|85
1
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