Manufacturer
NXP Semiconductors
Description
Processor, Multimedia Applications, No VCs, No GA, 19x19mm 529-Pin BGA, -40 to+95C, T/R
Datasheet
Type
Case/Package
Core Architecture
Data Bus Width
Frequency
Halogen Free
Height - Seated (Max)
Interface
Lead Free
Length
Lifecycle Status
Max Frequency
Max Operating Temperature
Max Supply Voltage
Memory Type
Min Operating Temperature
Min Supply Voltage
Number of Cores
Number of Pins
Number of Terminals
Operating Supply Voltage
Packaging
REACH SVHC
RoHS
Terminal Pitch
Weight
Width
Description
BGA
ARM
32 b
600 MHz
Halogen Free
1.6 mm
I2C, I2S, UART
Lead Free
19 mm
Production (Last Updated: 8 months ago)
800 MHz
85 °C
1.1 V
L2 Cache, ROM, SRAM
-20 °C
950 mV
1
529
529
1 V
Tape & Reel (TR)
Yes
Compliant
800 µm
1.01599 g
19 mm
MOQ : Unavailable
Minimum Qty : Unavailable
Per Unit Price
Unavailable
Total Price
Unavailable
Ships in 7-10 days from Bengaluru
Type
Case/Package
Core Architecture
Data Bus Width
Frequency
Halogen Free
Height - Seated (Max)
Interface
Lead Free
Length
Lifecycle Status
Max Frequency
Max Operating Temperature
Max Supply Voltage
Memory Type
Min Operating Temperature
Min Supply Voltage
Number of Cores
Number of Pins
Number of Terminals
Operating Supply Voltage
Packaging
REACH SVHC
RoHS
Terminal Pitch
Weight
Width
Description
BGA
ARM
32 b
600 MHz
Halogen Free
1.6 mm
I2C, I2S, UART
Lead Free
19 mm
Production (Last Updated: 8 months ago)
800 MHz
85 °C
1.1 V
L2 Cache, ROM, SRAM
-20 °C
950 mV
1
529
529
1 V
Tape & Reel (TR)
Yes
Compliant
800 µm
1.01599 g
19 mm
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