Manufacturer
NXP Semiconductors
Description
I.mx 6 Series 32-Bit Mpu, Dual Arm Cortex-A9 Core, 1Ghz, Fcbga 624 Rohs Compliant: Yes
Datasheet
Type
Case/Package
Core Architecture
Data Bus Width
Frequency
Halogen Free
Height - Seated (Max)
Interface
Length
Lifecycle Status
Max Frequency
Max Operating Temperature
Max Supply Voltage
Memory Size
Memory Type
Min Operating Temperature
Min Supply Voltage
Mount
Number of I/Os
Number of Pins
Number of Terminals
Number of Timers/Counters
Oscillator Type
Peripherals
Radiation Hardening
RAM Size
REACH SVHC
RoHS
Schedule B
Terminal Pitch
Weight
Width
Description
FCBGA
ARM
32 b
1 GHz
Halogen Free
2.16 mm
CAN, EBI/EMI, Ethernet, I2C, I2S, MMC, PCI, PCIe, SATA, SD, SPI, UART, USB
21 mm
NRND (Last Updated: 7 months ago)
1 GHz
125 °C
1.5 V
96 kB
External Program Memory, L2 Cache, ROM, SRAM
-40 °C
1.35 V
Surface Mount
224
624
624
4
Internal
DMA, PWM, WDT
No
256 kB
Yes
Compliant
8542310000
800 µm
3.323613 g
21 mm
MOQ : Unavailable
Per Unit Price
₹Infinity
Total Price
₹Infinity
Ships in 7-10 days from Bengaluru
Type
Case/Package
Core Architecture
Data Bus Width
Frequency
Halogen Free
Height - Seated (Max)
Interface
Length
Lifecycle Status
Max Frequency
Max Operating Temperature
Max Supply Voltage
Memory Size
Memory Type
Min Operating Temperature
Min Supply Voltage
Mount
Number of I/Os
Number of Pins
Number of Terminals
Number of Timers/Counters
Oscillator Type
Peripherals
Radiation Hardening
RAM Size
REACH SVHC
RoHS
Schedule B
Terminal Pitch
Weight
Width
Description
FCBGA
ARM
32 b
1 GHz
Halogen Free
2.16 mm
CAN, EBI/EMI, Ethernet, I2C, I2S, MMC, PCI, PCIe, SATA, SD, SPI, UART, USB
21 mm
NRND (Last Updated: 7 months ago)
1 GHz
125 °C
1.5 V
96 kB
External Program Memory, L2 Cache, ROM, SRAM
-40 °C
1.35 V
Surface Mount
224
624
624
4
Internal
DMA, PWM, WDT
No
256 kB
Yes
Compliant
8542310000
800 µm
3.323613 g
21 mm
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