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WL1801MODGBMOCT

Manufacturer

Texas Instruments

Description

WLAN+BTCombo Module Chip IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin LGA Module

Datasheet

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Product Attributes

Type

Case/Package

Current - Receiving

Current - Transmitting

Data Rate

Frequency

Height

Interface

Lead Free

Length

Lifecycle Status

Manufacturer Lifecycle Status

Max Operating Temperature

Max Supply Voltage

Min Operating Temperature

Min Supply Voltage

Mount

Number of Pins

Packaging

Radiation Hardening

REACH SVHC

RoHS

Sensitivity (dBm)

Thickness

Width

Description

Module

85 mA

420 mA

54 Mbps

2.4 GHz

2 mm

SDIO, UART

Contains Lead

13.3 mm

Production (Last Updated: 5 days ago)

ACTIVE (Last Updated: 5 days ago)

70 °C

4.8 V

-20 °C

2.9 V

Surface Mount

100

Digi-Reel®

No

No

Compliant

-96.3 dBm

2 mm

13.4 mm

1916.01

In Stock


Quantity
Shipment
delivery

Ships in 7-10 days

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Quantity

Unit Price

Ext. Price

1

1916.01

1916.01

10

1668.69

16686.85

25

1582.69

39567.35

50

1582.71

79135.60

100

1464.88

146487.84

500

1467.38

733689.09

Product Attributes

Type

Case/Package

Current - Receiving

Current - Transmitting

Data Rate

Frequency

Height

Interface

Lead Free

Length

Lifecycle Status

Manufacturer Lifecycle Status

Max Operating Temperature

Max Supply Voltage

Min Operating Temperature

Min Supply Voltage

Mount

Number of Pins

Packaging

Radiation Hardening

REACH SVHC

RoHS

Sensitivity (dBm)

Thickness

Width

Description

Module

85 mA

420 mA

54 Mbps

2.4 GHz

2 mm

SDIO, UART

Contains Lead

13.3 mm

Production (Last Updated: 5 days ago)

ACTIVE (Last Updated: 5 days ago)

70 °C

4.8 V

-20 °C

2.9 V

Surface Mount

100

Digi-Reel®

No

No

Compliant

-96.3 dBm

2 mm

13.4 mm

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