XC7Z035-2FBG676I
Manufacturer
AMD
Description
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA
Datasheet
DownloadProduct Attributes
Type
Case/Package
Contact Plating
Core Architecture
Frequency
Height - Seated (Max)
Interface
Length
Lifecycle Status
Max Operating Temperature
Max Supply Voltage
Min Operating Temperature
Min Supply Voltage
Mount
Number of I/Os
Number of Registers
Number of Terminals
Operating Supply Voltage
Peripherals
Propagation Delay
RAM Size
REACH SVHC
RoHS
Speed Grade
Terminal Pitch
Width
Description
FCBGA
Copper, Silver, Tin
ARM
800 MHz
2.54 mm
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
27 mm
Production (Last Updated: 8 months ago)
100 °C
1.05 V
-40 °C
950 mV
Surface Mount
130
343800
676
1 V
DMA
100 ps
250 kB
Yes
Compliant
2
1 mm
27 mm
In Stock
Quantity
MOQ : Unavailable
Per Unit Price
₹Infinity
Total Price
₹Infinity
Ships in 7-10 days from Bengaluru
Product Attributes
Type
Case/Package
Contact Plating
Core Architecture
Frequency
Height - Seated (Max)
Interface
Length
Lifecycle Status
Max Operating Temperature
Max Supply Voltage
Min Operating Temperature
Min Supply Voltage
Mount
Number of I/Os
Number of Registers
Number of Terminals
Operating Supply Voltage
Peripherals
Propagation Delay
RAM Size
REACH SVHC
RoHS
Speed Grade
Terminal Pitch
Width
Description
FCBGA
Copper, Silver, Tin
ARM
800 MHz
2.54 mm
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
27 mm
Production (Last Updated: 8 months ago)
100 °C
1.05 V
-40 °C
950 mV
Surface Mount
130
343800
676
1 V
DMA
100 ps
250 kB
Yes
Compliant
2
1 mm
27 mm
prototype to production:
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